Sheet No.: DG-072009
10
GM5GC96270A
?SPAN class="pst GM5GC96270A_2653258_2">Manufacturing Guidelines
?SPAN class="pst GM5GC96270A_2653258_2">Storage and Handling
1. Moisture-proofing: These parts are shipped in vacuum-sealed packaging to keep them dry and ready for use.
See Fig. 12.
2. Store these parts between 5癈 and 30癈, at a relative humidity of less than 60%.
3. After breaking the package seal, maintain the environment within 5癈 to 30癈, at a relative humidity of less than
60%. Solder the parts within 3 days.
4. If the parts will not be used immediately, repack them in a dry box, or re-vacuum-seal them with a desiccant.
5. If the parts are exposed to air for more than 3 days, or if the silica gel telltale indicates moisture contamination,
bake the parts:
"When in the tape carrier, bake them at a temperature of 95癈 to 100癈, for 16 to 24 hours.
"When loose (in a metal tray) or on a PCB, bake them at a temperature of 110癈 to 120癈, for 8 to 12 hours.
"Note that the reels may become distorted if they are in a stack when baking. Confirm that the parts have cooled
to room temperature after baking.
?SPAN class="pst GM5GC96270A_2653258_2">Cleaning Instructions
1. Sharp does not recommend cleaning printed circuit boards containing this device. Process chemicals will affect
the structural and optical characteristics of this device.
2. Use solder paste that does not require cleaning. Avoid using ultrasonic cleaning if possible.
3. If ultrasonic cleaning cannot be avoided, verify the process before beginning production. Compatible solvents
are water and isopropyl alcohol.
4. This device can be affected by ultrasonic cleaning; factors to be considered are the size of the bath, ultrasonic
output, duration, size of PCB, and the devices mounting method.
Fig. 12 Factory Moisture-proof Packaging
Aluminum
package
Silica gel
Reel
L l
Label
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